出展の見どころ
| Beijing YHXC Photonics Technology Co., LTD | ||
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レーザーEXPO No. D-49 |
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| 〒101400 | ||||||||||||||||
| Room 103, 1st Floor, Building 2, Yard 35, Yanqi Street, Yanqi Economic Development Zone, Huairou District, Beijing | ||||||||||||||||
| URL：http://www.yh-photonics.com | ||||||||||||||||
| ● 担当 | ||||||||||||||||
| General Manager Office Kai Li | ||||||||||||||||
| TEL：+86-13901099158 FAX：+86-010-61667649 | ||||||||||||||||
| ● 出展の見どころ | ||||||||||||||||
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Founded in November 2023 in Huairou Science City, Beijing YHXC Photonics is a national high-tech enterprise focusing on laser sources for semiconductor chip inspection. It offers four laser series covering 1064nm–193nm, achieves domestic substitution, and has strong R&D, patents, standards, and rapid growth.
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| ● 出展製品 | ||||||||||||||||
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Merak series picosecond laser The Merak-DUV series deep ultraviolet quasi-continuous wave (QCW) narrow-linewidth picosecond laser is a specialized light source capable of outputting laser radiation in the 266nm band. Its excellent beam quality, extremely narrow linewidth, exceptionally long operational lifetime, and stable, reliable performance have created value for customers in fields such as advanced node wafer inspection, precision machining, scientific research, and medical applications. This model has been fully localized and is customizable. |
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Megrez series continuous laser The Megrez-DUV series deep ultraviolet continuous narrow-linewidth picosecond laser is a specialized light source capable of outputting laser radiation in the 266nm band. Its excellent beam quality, extremely narrow linewidth, exceptionally long operational lifetime, and stable, reliable performance have created value for customers in fields such as advanced node wafer inspection, spectroscopy and fluorescence analysis, holography and interferometry, quantum optics and atomic physics, scientific research, and medical applications. This model has been fully localized and is customizable. |
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Dubhe series nanosecond laser The Dubhe series green nanosecond high-power laser serves as the primary model for wafer annealing. Laser Annealing is a heat treatment process that utilizes a high-energy-density laser beam to rapidly heat and cool the surface of a material. Unlike traditional furnace annealing (which involves bulk heating and slow cooling), laser annealing offers distinct advantages such as localized heating, rapid heating and cooling rates, and a small heat-affected zone. |
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